GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

This subclass covers : packages of devices and parts of such packages; interconnections of devices in chips, wafers, substrates or packages; connectors of devices in packages; other constructional details of devices in chips, wafers, substrates or packages, e.g. isolation regions between components of integrated devices; detachable holders for supporting packaged chips in operation; the manufacture or treatment of aspects (a)-(e); when aspects (a)-(e) are (1) applicable to devices covered by subclass H10B ; (2) applicable to devices covered by subclass H10D , except for semiconductor bodies or electrodes thereof, which are covered by subgroups H10D62/00 or H10D64/00 ; or (3) generically applicable to devices covered by subclasses H10B , H10D , H10F , H10H , H10K or H10N . In this subclass, the periodic system used is the I to VIII group system indicated in the Periodic Table under Note (3) of section C .