What is Next-Generation Semiconductor Types dsc_pkg_2d5?

Next-Generation Semiconductor Types dsc_pkg_2d5 is "2.5D Packaging (interposer, CoWoS, EMIB chiplets)". Next-Generation Semiconductor Types code dsc_pkg_2d5 covers "2.5D Packaging (interposer, CoWoS, EMIB chiplets)" at level 2 of the Next-Generation Semiconductor Types hierarchy.

Logic chips, memory, analog/mixed-signal, power semiconductors, photonics, MEMS, advanced packaging and foundry process taxonomy - Global

dsc_pkg_2d5 2.5D Packaging (interposer, CoWoS, EMIB chiplets)

Next-Generation Semiconductor Types classification code dsc_pkg_2d5 covers "2.5D Packaging (interposer, CoWoS, EMIB chiplets)" at level 2 of the Next-Generation Semiconductor Types hierarchy.

Level 2

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Where dsc_pkg_2d5 sits in the Next-Generation Semiconductor Types hierarchy

>dsc_pkg Advanced Semiconductor Packaging
>>dsc_pkg_2d5 2.5D Packaging (interposer, CoWoS, EMIB chiplets)
>>dsc_pkg_2d5 2.5D Packaging (interposer, CoWoS, EMIB chiplets)

Other Next-Generation Semiconductor Types codes under dsc_pkg_2d5 2.5D Packaging (interposer, CoWoS, EMIB chiplets)

Frequently asked questions

What is Next-Generation Semiconductor Types dsc_pkg_2d5?: Next-Generation Semiconductor Types dsc_pkg_2d5 is "2.5D Packaging (interposer, CoWoS, EMIB chiplets)". Next-Generation Semiconductor Types code dsc_pkg_2d5 covers "2.5D Packaging (interposer, CoWoS, EMIB chiplets)" at level 2 of the Next-Generation Semiconductor Types hierarchy.
What is the parent category of dsc_pkg_2d5?: dsc_pkg_2d5 2.5D Packaging (interposer, CoWoS, EMIB chiplets) sits under dsc_pkg_2d5 2.5D Packaging (interposer, CoWoS, EMIB chiplets) in the Next-Generation Semiconductor Types hierarchy.

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